期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1997, vol.119, no.1 1997, vol.119, no.3 1997, vol.119, no.4

题名作者出版年年卷期
A nonlinear multi-domain thermomechanical stress analysis method for surface-mount solder joint -- part II: viscoplastic analysisS. Ling; A. Dasgupta19971997, vol.119, no.3
Deformation mechanism of two-phase solder column interconnections under highly accelerated thermal cycling condition: an experimental studyB. Han19971997, vol.119, no.3
Determination of fracture toughness of thermally conductive adhesivesE. Jih; Y. -H. Pao; X. Song; C. Larner19971997, vol.119, no.3
Gull-wing solder joint fatigue life sensitivity evaluationT. E. Wong; L. A. Kachatorian; B. D. Tierney19971997, vol.119, no.3
Maximizing solder joint reliability through optimal shape designA. M. Deshpande; G. Subbarayan; R. L. Mahajan19971997, vol.119, no.3
Nonlinear analysis of full-matrix and perimeter plastic ball grid array solder jointsW. Jung; J. H. Lau; Y. -H. Pao19971997, vol.119, no.3
Stress analysis of surface-mount interconnections due to vibrational loadingK. Darbha; S. Ling; A. Dasgupta19971997, vol.119, no.3
The nature of centroidal locus in misaligned flip-chip solder jointsG. Subbarayan; A. Deshpande19971997, vol.119, no.3
Thermal and mechanical evaluations of a cost-effective plastic ball grid array packageJ. H. Lau; K. -L. Chen19971997, vol.119, no.3
Warpage and interfacial stress distribution in a single-level integrated module (SLIM)R. C. Dunne; S. K. Sitaraman19971997, vol.119, no.3



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