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1998, vol.89, no.1	1998, vol.89, no.10	1998, vol.89, no.11	1998, vol.89, no.12	1998, vol.89, no.2	1998, vol.89, no.3
1998, vol.89, no.4	1998, vol.89, no.5	1998, vol.89, no.6	1998, vol.89, no.7	1998, vol.89, no.8	1998, vol.89, no.9

题名	作者	出版年	年卷期
Filiform corrosion of coated aluminium components-means of avoiding the problem and methods for durable repairs; Part 1	Freudenberger, J.; Pietschmann, J.	1998	1998, vol.89, no.11
HDI printed circuit boards for cost reduction	Weinhold, M.	1998	1998, vol.89, no.11
Jobbing platers in an industry transformation	Landau, U.	1998	1998, vol.89, no.11
Passivation of the cathode surface during silver electrodeposition from a cyanide electrolyte part2: Surface condition of an unpolarised silver electrode in cyanide-containing solution	Baltrunas, G.	1998	1998, vol.89, no.11
Processes for the deposition of metallic coatings; Part3	Kanani, N.	1998	1998, vol.89, no.11
Reliability studies on printed circuit boards	Ehrler, S.	1998	1998, vol.89, no.11