期刊


ISSN1340-2625
刊名まてりあ
参考译名金属
收藏年代1998～2025



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1999, vol.38, no.1 1999, vol.38, no.10 1999, vol.38, no.11 1999, vol.38, no.12 1999, vol.38, no.2 1999, vol.38, no.3
1999, vol.38, no.4 1999, vol.38, no.5 1999, vol.38, no.6 1999, vol.38, no.7 1999, vol.38, no.8 1999, vol.38, no.9

题名作者出版年年卷期
Analyses of microstructure evolutions during reverse phase transformations in alloyed steels using calculated phase diagramsDmitry V. Shtansky19991999, vol.38, no.12
Current status of R&D project of lead-free soldersTadatomo Suga19991999, vol.38, no.12
Development of lead-free soldering and establishment of new productKenichiro Suetsugu19991999, vol.38, no.12
Development of plating for lead-free solder jointSusumu Arai; Naoyuki Shinohara; Norio Kaneko19991999, vol.38, no.12
Electrical reliability on the degradation due to electrochemical migration for PCBsTsutomu Tsukui19991999, vol.38, no.12
Evaluation of solder alloy characteristics by a strain rate changing tensile testTadashi Takemoto19991999, vol.38, no.12
Fatigue characteristics of lead-free solder alloysYoshiharu Kariya; Masahisa Otsuka19991999, vol.38, no.12
Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free solderingJames H. Vincent19991999, vol.38, no.12
Lead free solder development in computer and communication equipmentEiichi Kono19991999, vol.38, no.12
Lift-off phenomenon in tin binary alloysHisaaki Takao; Hideo Hasegawa19991999, vol.38, no.12
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