期刊


ISSN0021-4787
刊名溶接学会誌
参考译名焊接学会志
收藏年代1997～2024

关联期刊参考译名收藏年代
溶接学会論文集焊接学会论文集1997～2023


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1997 1998 1999 2000 2001 2002
2004 2005 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2000, vol.69, no.1 2000, vol.69, no.2 2000, vol.69, no.3 2000, vol.69, no.4 2000, vol.69, no.5 2000, vol.69, no.6
2000, vol.69, no.7 2000, vol.69, no.8

题名作者出版年年卷期
Application of lead free solders to semiconductor packagesKoji Serizawa; Kazuma Miura; Hanae Shimokawa; Tetsuya Nakatsuka20002000, vol.69, no.2
Application of optical sensor for arc weldingSatoru Asai20002000, vol.69, no.2
Current soldering technology and reliability issue in lead-free solder for electronic assemblyYoshiharu Kariya; Mashahisa Otsuka20002000, vol.69, no.2
Direct atomistic observation of adhesionTokushi Kizuka20002000, vol.69, no.2
Evaluation of lead-free flux cored wire solder in SonyRyo Ueda; Masanobu Okuyama; Jiro Abe; Tomoya Kiga; Yoshikuni Taniguchi20002000, vol.69, no.2
Load dependence of atomic scale frictionSatoru Fujisawa20002000, vol.69, no.2
Making best use of the arc sensorYuji Sugitani20002000, vol.69, no.2
Mechanism of bond formation and effects of surface roughness in room temperature wafer bondingHideki Takagi20002000, vol.69, no.2
Micro-particle assembly under scanning electron Microscope observationHideki T. Miyazaki; Hiroshi Morishita20002000, vol.69, no.2
Physical interpretation of adhesion phenomena and it applicationKunio Takahashi20002000, vol.69, no.2
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