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2000, vol.44, no.1	2000, vol.44, no.10	2000, vol.44, no.11	2000, vol.44, no.12	2000, vol.44, no.2	2000, vol.44, no.3
2000, vol.44, no.4	2000, vol.44, no.5	2000, vol.44, no.7	2000, vol.44, no.8	2000, vol.44, no.9

题名	作者	出版年	年卷期
Bonded-abrasive polishing of silicon	Junichi Ikeno	2000	2000, vol.44, no.10
Formation conditions of breakout/burr in edge-finishing of titanium aluminide intermetallic compounds	Toshiaki Furusawa; Hiroshi Hino; Shinji Tsuji; Atsushi Ichikawa; Sadatoshi Koroyasu	2000	2000, vol.44, no.10
Influence of hardness of elastic relief pad on the CMP characteristics	Akihiko Saguchi; Masahiro Ogawa; Wataru Takahashi; Junji Watanabe	2000	2000, vol.44, no.10
Influence of wear of abrasive grains on the wet-blasted surface texture	Kazuhisa Yanagi; Kohei Murakami; Seiichiro Hara; Masahiro Kato; Toru Matsubara	2000	2000, vol.44, no.10
Microscopic mechanism of ductile mode grinding of silicon wafer	Noboru Morita	2000	2000, vol.44, no.10
Numerically controlled dry flattening of Si wafer	Yanagisawa Michihiko	2000	2000, vol.44, no.10
Polishing of Si wafers	Nobuo Yasunaga	2000	2000, vol.44, no.10
Study on vibration cutting characteristics of Al{sub}2O{sub}3 and SiC ceramic by OD-blade	Michio Uneda; Ken-ichi Ishikawa; Hitoshi Suwabe	2000	2000, vol.44, no.10