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题名	作者	出版年	年卷期
Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance	Barry K. Gilbert; Michael J. Degerstrom; Patrick J. Zabinski; Timothy M. Schaefer; Gregg J. Fokken; Barbara A. Randall; Daniel J. Schwab; Erik S. Daniel; Scott C. Sommerfeldt	2001	2001, vol.89, no.4
Integration and electrical isolation in CMOS mixed-signal wireless chips	Robert C. Frye	2001	2001, vol.89, no.4
RF/wireless interconnect fo rinter-and intra-chip communications	Mau-Chung Frank Chang; Vwani P. Roychowdhury; Liyang Zhang; Hyunchol Shin; Yongxi Qian	2001	2001, vol.89, no.4
Impact of small process geometries on microarchitectures in systems on a chip	Dennis Sylvester; Kurt Keutzer	2001	2001, vol.89, no.4
The future of wires	Ron Ho. Member; Kenneth W. Mai; Mark A. Horowitz	2001	2001, vol.89, no.4
An interconnect-centric design flow for nanometer technologies	Jason Cong	2001	2001, vol.89, no.4
On-chip wiring design challenges for gigahertz operation	Alina Deutsch; Paul W. Coteus; Gerard V. Lopcsay; Howard H. Smith; Christopher W. Surovic; Byron L. Krauter; Daniel C. Edelstein; Phillip J. Restle	2001	2001, vol.89, no.4
The challenge of signal integrity in deep-submicrometer CMOS technology	Fabric Caignet; Sonia Demlas-Bendhia; Etienne Sicard	2001	2001, vol.89, no.4