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期刊
ISSN
0020-2967
刊名
Transactions of the Institute of Metal Finishing
参考译名
金属精饰学会汇刊
收藏年代
1998~2024
全部
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2001, vol.79, no.1
2001, vol.79, no.2
2001, vol.79, no.3
2001, vol.79, no.4
2001, vol.79, no.6
2001, vol.79, part 5
题名
作者
出版年
年卷期
Hydrogen embrittlement from metal finishing processes
David R. Gabe
2001
2001, vol.79, part 5
Alternatives to decorative hexavalent chrome electrodeposits
Maurice Pye
2001
2001, vol.79, part 5
Development of electroless nickel bath life extension - the EDEN system
Graham Orgill; Rainer Born; Werner Richtering
2001
2001, vol.79, part 5
Atmospheric pressure plasma cleaning of aluminium
S. J. M. Pinson; J. Collins; G. E. Thompson; M. R. Alexander
2001
2001, vol.79, part 5
Stress determination in pulse electroplated gold deposits
D. L. Rehrig; N. V. Mandich Fimf
2001
2001, vol.79, part 5
Interface processes at RuO{sub}2/Ti based electrodes
J. P. G. Farr; L. X. Yang
2001
2001, vol.79, part 5
Electroplating of copper from an amine based noncyanide bath
Sobha Jayakrishnan; A. Vinothini; C. Kala; S. Sriveeraraghavan; R. M. Krishnan
2001
2001, vol.79, part 5
The structure and texture development of Ni alloy electrodeposits. (2) Nickel-iron duplex and multilayered deposits
D. B. Lewis; C. E. Lehmberg; G. W. Marshall
2001
2001, vol.79, part 5
XPS, ellipsometry and electrochemical studies on the passivity of alloy-800
S. V. Phadnis; A. Bose; J. C. Vyas; M. K. Totlani
2001
2001, vol.79, part 5
Effect of nitrogen partial pressure on the electrochemical evaluation of (Ti-Al)N coatings deposited by reactive magnetron sputtering
Kulwant Singh; A. K. Grover; M. K. Totlani; A. k. Suri
2001
2001, vol.79, part 5
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