期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：元件和材料
收藏年代2000～2024



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2000 2001 2002 2013 2015 2020
2021 2022 2023 2024

2001, vol.101, no.244 2001, vol.101, no.245 2001, vol.101, no.315 2001, vol.101, no.395 2001, vol.101. no.516 2001, vol.101. no.517

题名作者出版年年卷期
Analog BOST (Built-Out Self-Test) - super low-cost analog test technology of a system LSI eraHidekazu Nagasawa; Hisayoshi Hanai; Eisaku Yamashita; Teruhiko Funakura; Hisaya Mori20012001, vol.101. no.517
Quasi-worst-condition built-in-self-test scheme for a 4-Mb loadless CMOS four-transistor SRAM macroKoichi Takeda; Yoshiharu Aimoto; Kazuyuki Nakamura; Sadaaki Masuoka; Katsuyuki Ishikawa; Kenji Noda; Toshio Takeshima; Tatsunori Murotani20012001, vol.101. no.517
A shared built-in self-repair analysis for multiple embedded memoriesMasanao Maruta; Jun Ohtani; Tomoya Kawagoe; Mitsutaka Niiro; Tukasa Ooishi; Mitsuhiro Hamada; Hideto Hidaka20012001, vol.101. no.517
An SOA based optical preamplifier with the automatic gain/loss controlled circuit for wide input dynamic rangeJun Endo; Toshio Ito; Akira Ohki; Rieko Sato; Yuichi Tohmori; Noboru Ishihara; Yasuhiro Suzuki20012001, vol.101. no.517
Embedded TiN{sub}xO{sub}y thin-film resistors in a build-up CSP for 10 Gbps optical transmitter and receiver modulesAkinobu Shibuya; Koji Matsui; Kazufumi Takahashi; Atsuhiro Kawatani20012001, vol.101. no.517
Optical component coupling using self-written waveguidesNaohiro Hirose; Osamu Ibaragi20012001, vol.101. no.517
Surface-mountable optical-I/O chip packages for chip-to-chip optical interconnectionsYuzo Ishii; Hideyuki Takahara20012001, vol.101. no.517
Thermal design of the 3D die-stacked moduleYasuhiro Yamaji; Tatsuya Ando; Tadahiro Morifuji; Tomotoshi Sato; Kenji Takahashi20012001, vol.101. no.516
ITC coding processor with GA - a proposal of architecture (1)Takeshi Furukawa; Tomo Ishikawa; Arata Miyauchi20012001, vol.101. no.516
An efficient power-supply regulator for ultra low power wireless applicationsKotaro Higuchi; Kenichi Nakashi; Yukinori Kuroki20012001, vol.101. no.516
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