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题名	作者	出版年	年卷期
The structure and function of the latest wire saw	Kunio Makino; Koji Fukuda	2001	2001, vol.45, no.8
Water-soluble slurry for wire saw slicing	Hiroshi Oishi	2001	2001, vol.45, no.8
Technology of fine steel wire for multi-wire saw	Ichiro Nagao	2001	2001, vol.45, no.8
Thin wire tool electrodeposited diamond grains and high-speed slicing system	Hitoshi Suwabe; Ken-ichi Ishikawa	2001	2001, vol.45, no.8
Fixed diamond wire saw 「PWS」	Hideki Ogawa	2001	2001, vol.45, no.8
Grinding force of silicon wafers by wafer rotation grinding	Satoshi Matsui	2001	2001, vol.45, no.8
A study of ductile/brittle modes grinding of PZT ceramics	Takeshi Tanaka; Yoshitada Isono	2001	2001, vol.45, no.8
Study on form grinding with cBN wheels - characteristics of profile wear	Sunarto; Yoshio Ichida	2001	2001, vol.45, no.8
Evaluation of HSK-A63 grinding spindle on CNC high speed tool & cutter grinder	Shigeru Inoue; Tojiro Aoyama; Masayori Itoh	2001	2001, vol.45, no.8