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题名	作者	出版年	年卷期
Tools for optimizing Cu electrodeposition: modeling and reagent addition monitoring	Norbert L. Piret	2002	2002, vol.54, no.4
Using CollaMat to measure glue in copper electrolyte	Peter Stantke	2002	2002, vol.54, no.4
Applying the haring cell to monitor glue addition	James E. Hoffmann	2002	2002, vol.54, no.4
Current density limitation and diffusion boundary layer calculation using CFD method	A. Filzwieser; K. Hein; G. Mori	2002	2002, vol.54, no.4
Using polyethylene glycols as alternative inhibitors in copper electrorefining	Michael Stelter; Hartmut Bombach; Nikolay Nesterov	2002	2002, vol.54, no.4
Evaluating and monitoring nucleation and growth in copper foil	Ye-Kun Lee; Thomas J. O'Keefe	2002	2002, vol.54, no.4
Producing bismuth trioxide and its application in fire assaying	Zack Kelly; Funsho Ojebuoboh	2002	2002, vol.54, no.4