期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998～2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2024

2002, vol.54, no.1 2002, vol.54, no.10 2002, vol.54, no.11 2002, vol.54, no.12 2002, vol.54, no.2 2002, vol.54, no.3
2002, vol.54, no.4 2002, vol.54, no.5 2002, vol.54, no.6 2002, vol.54, no.7 2002, vol.54, no.8 2002, vol.54, no.9

题名作者出版年年卷期
The symposium imaging of dynamic processes: multimedia highlightsIver E. Anderson20022002, vol.54, no.6
Developments in lead-free solders and soldering technologySung K. Kang20022002, vol.54, no.6
Sn-Ag-Cu solders and solder joints: alloy development, microstructure, and propertiesI. E. Anderson; B. A. Cook; J. L. Harringa; R. L. Terpstra20022002, vol.54, no.6
The creep properties of lead-free solder jointsH. G. Song; J. W. Morris, Jr.; F. Hua20022002, vol.54, no.6
Electromigration in solder joints and solder linesH. Gan; W. J. Choi; G. Xu; K. N. Tu20022002, vol.54, no.6
Aspects of the structural evolution of lead-free solder jointsA. Zribi; R. Kinyanjui; P. Borgesen; L. Zavalij; E. J. Cotts20022002, vol.54, no.6
Experiments for first year engineering students using Tin-bismuth alloysMark A. Palmer; Kurt Wainwright; Lung C. Fok; Benjamin Jones20022002, vol.54, no.6
Using mechanical processing in recycling printed wiring boardsHugo M. Veit; Carolina de C. Pereira; Andrea M. Bernardes20022002, vol.54, no.6
The electrochemical recycling of printed-wiring-board etchantsP. Adaikkalam; G. N. Srinivasan; K. V. Venkateswaran20022002, vol.54, no.6
Recovering copper using a combination of electrolytic cellsShijie Wang20022002, vol.54, no.6
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