期刊


ISSN0915-1869
刊名表面技術
参考译名表面技术
收藏年代1998～2025



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2002, vol.53, no.1 2002, vol.53, no.10 2002, vol.53, no.12 2002, vol.53, no.2 2002, vol.53, no.3 2002, vol.53, no.4
2002, vol.53, no.5 2002, vol.53, no.6 2002, vol.53, no.7 2002, vol.53, no.8 2002, vol.54, no.2

题名作者出版年年卷期
Dissolution of Cu (I) CN highly concentrated alkaline solutionKazuhiro Honda20022002, vol.54, no.2
Structures and improvement of temperature coefficient of resistance of Pt/Ti thin films prepared on SiO{sub}2/Al{sub}2O{sub}3 by sputtering under argon-oxygen gas mixturesNoriko Hanzawa; Kenji Tomonari; Shin-ichi Inoue; Kiyoshi Yamagishi; Yoshihira Aoki; Yoshihiko Gotoh20022002, vol.54, no.2
Adsorbates formed on non-conducting substrates by two-step catalyzation pretreatment for electroless platingKenji Yamagishi; Shinji Yae; Naoki Okamoto; Naoki Fukumuro; Hitoshi Matsuda20022002, vol.54, no.2
New electrolyte solutions for electrochemical etching of NiTi shape memory alloyTakashi Mineta20022002, vol.54, no.2
Fabrication of micro-printed circuit board by aluminum anodizing and laser irradiation - influence of thickness of oxide film on formation of patternTatsuya Kikuchi; Masatoshi Sakairi; Hideaki Takahashi; Yoshihiko Abe; Naoki Katayama20022002, vol.54, no.2
Sol-Gel coating on magnesium alloy and its evaluation of corrosion resistanceHitonori Sato; Shinji Hirai; Kazuyoshi Shimakage; Kenji Wada20022002, vol.54, no.2
Reliability and interfacial structures of solder joint between lead free solder and electroless plated Ni-P alloy filmYasunori Chonan; Takao Komiyama; Jin Onuki20022002, vol.54, no.2
Plating technologies for joints used in tape carriers for semiconductor packagesAkira Chinda20022002, vol.54, no.2
Joint reliability and plating technology in semiconductor packagingYutaka Tsukada20022002, vol.54, no.2
Micro-connection for IC Bonding using electroless platingYuji Nishitani; Hisashi Hayakawa; Ken Orui; Hiroko Jinno; Hiroshi Asami20022002, vol.54, no.2
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