期刊


ISSN0288-4771
刊名溶接学会論文集
参考译名焊接学会论文集
收藏年代1997～2023

关联期刊参考译名收藏年代
溶接学会誌焊接学会志1997～2024


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2003 2004 2005 2006 2007 2008
2009 2010 2011 2012 2013 2014
2015 2016 2017 2018 2019 2020
2021 2022 2023

2003, vol.21, no.2 2003, vol.21, no.3 2003, vol.21, no.4

题名作者出版年年卷期
Effect of Friction Speed on Initial Seizure Portion on Welded Interface - Study of Joining Mechanism of Friction Welding (Report 4) -KIMURA Masaaki; OHTSUKA Yosuke; AN Gyu-Baek; KUSAKA Masahiro; SEO Kenji; FUJI Akiyoshi20032003, vol.21, no.4
HVOF Spraying of Mechanically Alloyed WC-Co Powder and Evaluation of its Coating PropertyFUKUMOTO Masahiro; Young-gyo. Jung; OZEKI Kenji; YAMADA Takanobu20032003, vol.21, no.4
Fatigue Strength of SM570Q Steel Non-Load -Carrying Cruciform Welded Joints by σ{sub}(max) = σ{sub}y TestOHTA Akihiko; MAEDA Yoshio; SUZUKI Naoyuki20032003, vol.21, no.4
Criterion for Ductile Cracking of Structural Steel under Cyclic Loading - Evaluation of Ductile Crack Initiation for Welded Structures Subjected to Large Scale Cyclic Loading (Report 1) -OHATA Mitsuru; YOKOTA Masaki; HIRONO Masahiko; YASUDA Osamu; TOYODA Masao20032003, vol.21, no.4
Fatigue test on Large-scale Welded Girder Specimens with Hot Dip Galvanizing - Fatigue Strength of Welded Joints by Hot Dip Galvanizing (Report 2) -MINAMI Kuniaki; MORI Takeshi; HORIKAWA Hidenobu20032003, vol.21, no.4
Stress properties of Welded Portions by Hot Dip Galvanizing and Fatigue test - Fatigue Strength of Welded Joins by Hot Dip Galvanizing (Report 1) -MINAMI Kuniaki; MORI Takeshi; HORIKAWA Hidenobu20032003, vol.21, no.4
Influence of Silicon Nitride Properties on Bonding Strength of Silicon Nitride and Stainless Steel Brazed JointsNAKAHASHI Masako; YASUDA Yuji; ITO Toshiaki; OKABE Nagatoshi20032003, vol.21, no.4
Laser Weldability of High Strength Steel Sheets in Fabrication of Tailor Welded BlanksONO Moriaki; YOSHITAKE Akihide; OHMURA Masanori20032003, vol.21, no.4
Lap Welding of Titanium Sheet and Mild Steel Sheet by Seam WeldingNISHIO Kazumasa; KATOH Mitsuaki; YAMAGUCHI Tomiko; TOKUNAGA Tatsuya; MATSUMOTO Atsuo20032003, vol.21, no.4
Ultrasonic Evaluation of Wire Bonded Areas in Semiconductor DevicesSATONAKA Shinobu; UENO Kazuya; TAIRA Masaki; GOTO Susumu20032003, vol.21, no.4
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