期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2003, vol.125, no.1 2003, vol.125, no.2 2003, vol.125, no.3 2003, vol.125, no.4

题名作者出版年年卷期
Statistical Aspects of Lifetime in the Presence of UV RadiationMichael I. Zeifman; Dov Ingman20032003, vol.125, no.1
Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered StructuresMehrdad N. Ghasemi Nejhad; Chiling Pan; Hongwei Feng20032003, vol.125, no.1
Extending the Fatigue Life of Solder Grid Array (SGA) Electronic PackagesMichael C. Larson; Melody A. Verges20032003, vol.125, no.1
Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill MaterialsTimothy Ferguson; Jianmin Qu20032003, vol.125, no.1
Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-NotchToru Ikeda; Isao Arase; Yuya Ueno; Noriyuki Miyazaki; Nobutaka Ito; Mami Nagatake; Mitsuru Sato20032003, vol.125, no.1
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection SystemSheng Liu; I. Charles Ume20032003, vol.125, no.1
Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip AssembliesJi Eun Park; Iwona Jasiuk; Alek Zubelewicz20032003, vol.125, no.1
Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions - Cylindrical BendingYibin Xue; Vivek A. Jairazbhoy; Xiaoting Niu; Jianmin Qu20032003, vol.125, no.1
Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb SoldersHaruo Nose; Masao Sakane; Yutaka Tsukada; Hideo Nishimura20032003, vol.125, no.1
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection - Part I: Experimental Methods and Numerical ModelingPeter J. Rodgers; Valerie C. Eveloy; Mark R. D. Davies20032003, vol.125, no.1
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