期刊


ISSN0268-3768
刊名The International Journal of Advanced Manufacturing Technology
参考译名先进制造技术国际杂志
收藏年代1998～2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2003, vol.21, no.1 2003, vol.21, no.10-11 2003, vol.21, no.12 2003, vol.21, no.2 2003, vol.21, no.3 2003, vol.21, no.4
2003, vol.21, no.5 2003, vol.21, no.6 2003, vol.21, no.7 2003, vol.21, no.8 2003, vol.21, no.9 2003, vol.22, no.11-12
2003, vol.22, no.1-2 2003, vol.22, no.3-4 2003, vol.22, no.5-6 2003, vol.22, no.7-8 2003, vol.22, no.9-10

题名作者出版年年卷期
A faster, more reliable solver of regular-grid TSPs: single value threshold acceptingLungHsi Chen; Jyhjeng Deng; HsinShih Chen; MingHua Chen20032003, vol.22, no.1-2
Damage prediction in L-bending processes using FEMRidha Hambli; All Mkaddem; Alain Potiron20032003, vol.22, no.1-2
Predication of optimum clearance in sheet metal blanking processesR. Hambli S. Rlchir; P. Crubleau; B. Taravel20032003, vol.22, no.1-2
Anasynchronous and synchronous coupling approach in networked rapid product developmentYanrong Ni; Feiya Fan; Juanqi Yan; Dengzhe Ma; Ye Jin20032003, vol.22, no.1-2
Application of mobile agents in a web-based real-time monitoring systemS. K. Ong; W. W. Sun20032003, vol.22, no.1-2
Neural network modeling and analysis of the material removal process during laser machiningBasem F. Yousef; George K. Knopf; Evgueni V. Bordatchev; Suwas K. Nikurnb20032003, vol.22, no.1-2
Constrained deformation of freeform surfaces using surface features for interactive designJ. M. Zheng; K. W. Chan; I. Gibson20032003, vol.22, no.1-2
A new rapid manufacturing process for multi-face high-speed machiningB. S. Shin; D. Y. Yang; D. S. Choi; E. S. Lee; T. J. Je; K. H. Whang20032003, vol.22, no.1-2
A simulated annealing algorithm for integration of shop floor control strategies in semiconductor wafer fabricationD. Y. Sha; Chao-Yang Liu20032003, vol.22, no.1-2
A dynamic inventory-production scheduling model for small scale organisationsI. K. Hui; H. C. W. Lau20032003, vol.22, no.1-2
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