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2003, vol.55, no.1	2003, vol.55, no.10	2003, vol.55, no.11	2003, vol.55, no.12	2003, vol.55, no.2	2003, vol.55, no.3
2003, vol.55, no.4	2003, vol.55, no.5	2003, vol.55, no.6	2003, vol.55, no.7	2003, vol.55, no.8	2003, vol.55, no.9

题名	作者	出版年	年卷期
Welding: solidification and microstructure	S. A. David; S. S. Babu; J. M. Vitek	2003	2003, vol.55, no.6
Prototype analysis of gravity-modulated welding by inverting weld cross sections	K. P. Cooper; S. C. Lambrakos; H. N. Jones III	2003	2003, vol.55, no.6
Weld analysis using an inverse-problem approach based on quasi-one-dimensional interpolation	S. G. Lambrakos; J. O. Milewski; P. G. Moore	2003	2003, vol.55, no.6
Solidification and liquation cracking issues in welding	Sindo Kou	2003	2003, vol.55, no.6
Submicron particle chemistry: vapor condensation analogous to liquid solidification	Neil T. Jenkins; Thomas W. Eagar	2003	2003, vol.55, no.6
The compression stress-strain behavior of Sn-Ag-Cu solder	Paul T. Vianco; Jerome A. Rejent; Joseph J. Martin	2003	2003, vol.55, no.6
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder	F. Ochoa; J. J. Williams; N. Chawla	2003	2003, vol.55, no.6
Ag{sub}3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu	Sung K. Kang; Won Kyoung Choi; Da-Yuan Shih; Donald W. Henderson; Timothy Gosselin; Amit Sarkhel; Charles Goldsmith; Karl J. Puttlitz	2003	2003, vol.55, no.6
Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation	R. R. Chromik; R. P. Vinci; S. L. Allen; M. R. Notis	2003	2003, vol.55, no.6