期刊


ISSN1047-4838
刊名JOM
参考译名矿物、金属与材料学会会刊
收藏年代1998~2024



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2004 2005 2006 2007 2008 2009
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2004, vol.56, no.1 2004, vol.56, no.10 2004, vol.56, no.12 2004, vol.56, no.2 2004, vol.56, no.3 2004, vol.56, no.4
2004, vol.56, no.5 2004, vol.56, no.6 2004, vol.56, no.7 2004, vol.56, no.8 2004, vol.56, no.9

题名作者出版年年卷期
Controlling Ag{sub}3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn AlloyingSung K. Kang; Da-Yuan Shih; Donovan Leonard; Donald W. Henderson; Timothy Gosselin; Sung-il Cho; Jin Yu; Won K. Choi20042004, vol.56, no.6
Nanomaterials in Nanoelectronics: Who's Who and What's NextMindy N. Rittner20042004, vol.56, no.6
Ancient iron and bronze piedes from La tejada: characterization studiesJ. M. Gomez de Salazar; M. I. Barrena; A. Soria20042004, vol.56, no.6
Carbon Nanotubes and Other Fullerene-Related Nanocrystals in the Environment: A TEM StudyL. E. Murr; K. F. Soto; E. V. Esquivel; J. J. Bang; P. A. Guerrero; D. A. Lopez; D. A. Ramirez20042004, vol.56, no.6
The Observation and Simulation of Sn-Ag-Cu Solder Solidification in Chip-Scale PackagingKeun-Soo Kim; Katsuaki Suganuma; Jong-Min Kim; Chi-Won Hwang20042004, vol.56, no.6
Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length ScalesM. Kerr; N. Chawla20042004, vol.56, no.6
Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with PlatinumTae Hyun Kim; Young-Ho Kim20042004, vol.56, no.6
Building a better workforce through improved MSE educationMaureen Byko20042004, vol.56, no.6
Global Perspectives on Electronic Materials: Challenges and OpportunitiesWarren H. Hunt, Jr.20042004, vol.56, no.6