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题名	作者	出版年	年卷期
Controlling Ag{sub}3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying	Sung K. Kang; Da-Yuan Shih; Donovan Leonard; Donald W. Henderson; Timothy Gosselin; Sung-il Cho; Jin Yu; Won K. Choi	2004	2004, vol.56, no.6
Nanomaterials in Nanoelectronics: Who's Who and What's Next	Mindy N. Rittner	2004	2004, vol.56, no.6
Ancient iron and bronze piedes from La tejada: characterization studies	J. M. Gomez de Salazar; M. I. Barrena; A. Soria	2004	2004, vol.56, no.6
Carbon Nanotubes and Other Fullerene-Related Nanocrystals in the Environment: A TEM Study	L. E. Murr; K. F. Soto; E. V. Esquivel; J. J. Bang; P. A. Guerrero; D. A. Lopez; D. A. Ramirez	2004	2004, vol.56, no.6
The Observation and Simulation of Sn-Ag-Cu Solder Solidification in Chip-Scale Packaging	Keun-Soo Kim; Katsuaki Suganuma; Jong-Min Kim; Chi-Won Hwang	2004	2004, vol.56, no.6
Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales	M. Kerr; N. Chawla	2004	2004, vol.56, no.6
Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platinum	Tae Hyun Kim; Young-Ho Kim	2004	2004, vol.56, no.6
Building a better workforce through improved MSE education	Maureen Byko	2004	2004, vol.56, no.6
Global Perspectives on Electronic Materials: Challenges and Opportunities	Warren H. Hunt, Jr.	2004	2004, vol.56, no.6