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期刊
ISSN
0957-4522
刊名
Journal of Materials Science
参考译名
材料科学杂志:电子材料
收藏年代
1999~2013
全部
1999
2000
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2002
2003
2004
2005
2006
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2013
2004, vol.15, no.1
2004, vol.15, no.10
2004, vol.15, no.11
2004, vol.15, no.12
2004, vol.15, no.2
2004, vol.15, no.3
2004, vol.15, no.4
2004, vol.15, no.5
2004, vol.15, no.6
2004, vol.15, no.7
2004, vol.15, no.8
2004, vol.15, no.9
题名
作者
出版年
年卷期
Ge nanostructures: average and local structure
A. V. KOLOBOV
2004
2004, vol.15, no.4
Structural, mechanical, hardness indentation measurements of Sn{sub}(65-x)Ag{sub}25Sb{sub}10Cu{sub}x solder alloys rapidly solidified from melt at cooling rate 1.1 × 10{sup}5K s{sup}(-1)
R. M. SHALABY
2004
2004, vol.15, no.4
The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn-Cd binary alloys
MUSTAFA KAMAL; ABU BAKR EL-BEDIWI
2004
2004, vol.15, no.4
Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solder
IKUO SHOHJI; TOMOHIRO YOSHIDA; TAKEHIKO TAKAHASHI; SUSUMU HIOKI
2004
2004, vol.15, no.4
Space-charge-limited current analysis in amorphous InSe thin films
K. YILMAZ; M. PARLAK; C. ERCELEBI
2004
2004, vol.15, no.4
Yttrium-substituted bismuth titanate (Bi{sub}(4-x)Y{sub}xTi{sub}3O{sub}12) thin film for use in non-volatile memories
S. W. KANG; S. W. RHEE
2004
2004, vol.15, no.4
Effect of anisotropy of tin on thermomechanical behavior of solder joints
K. N. SUBRAMANIAN; J. G. LEE
2004
2004, vol.15, no.4
Sintering condition and PTCR characteristics of porous (Ba,Sr)(Ti,Sb)O{sub}3
J. -G. KIM, W. -P. TAI ; J. -M. LEE; J. -G. HA; S. -M. LIM
2004
2004, vol.15, no.4
Interface structure and electrical properties of PtSi/Si{sub}(1-x)Ge{sub}x diodes based on silicon
MEICHENG LI; LIANCHENG ZHAO; XIHE ZHEN; XUEKANG CHEN
2004
2004, vol.15, no.4
Evaluation of residual stress in BaTiO{sub}3-based Ni-MLCCs with X7R characteristics
DONG-HO PARK; YEON-GIL JUNG; UNGYU PAIK
2004
2004, vol.15, no.4
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