期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志：电子材料
收藏年代1999～2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2004, vol.15, no.1 2004, vol.15, no.10 2004, vol.15, no.11 2004, vol.15, no.12 2004, vol.15, no.2 2004, vol.15, no.3
2004, vol.15, no.4 2004, vol.15, no.5 2004, vol.15, no.6 2004, vol.15, no.7 2004, vol.15, no.8 2004, vol.15, no.9

题名作者出版年年卷期
Ge nanostructures: average and local structureA. V. KOLOBOV20042004, vol.15, no.4
Structural, mechanical, hardness indentation measurements of Sn{sub}(65-x)Ag{sub}25Sb{sub}10Cu{sub}x solder alloys rapidly solidified from melt at cooling rate 1.1 × 10{sup}5K s{sup}(-1)R. M. SHALABY20042004, vol.15, no.4
The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn-Cd binary alloysMUSTAFA KAMAL; ABU BAKR EL-BEDIWI20042004, vol.15, no.4
Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solderIKUO SHOHJI; TOMOHIRO YOSHIDA; TAKEHIKO TAKAHASHI; SUSUMU HIOKI20042004, vol.15, no.4
Space-charge-limited current analysis in amorphous InSe thin filmsK. YILMAZ; M. PARLAK; C. ERCELEBI20042004, vol.15, no.4
Yttrium-substituted bismuth titanate (Bi{sub}(4-x)Y{sub}xTi{sub}3O{sub}12) thin film for use in non-volatile memoriesS. W. KANG; S. W. RHEE20042004, vol.15, no.4
Effect of anisotropy of tin on thermomechanical behavior of solder jointsK. N. SUBRAMANIAN; J. G. LEE20042004, vol.15, no.4
Sintering condition and PTCR characteristics of porous (Ba,Sr)(Ti,Sb)O{sub}3J. -G. KIM, W. -P. TAI ; J. -M. LEE; J. -G. HA; S. -M. LIM20042004, vol.15, no.4
Interface structure and electrical properties of PtSi/Si{sub}(1-x)Ge{sub}x diodes based on siliconMEICHENG LI; LIANCHENG ZHAO; XIHE ZHEN; XUEKANG CHEN20042004, vol.15, no.4
Evaluation of residual stress in BaTiO{sub}3-based Ni-MLCCs with X7R characteristicsDONG-HO PARK; YEON-GIL JUNG; UNGYU PAIK20042004, vol.15, no.4
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