• 知识中心主页
  • 文献服务
  • 文献资源
    • 外文期刊
    • 外文会议
  • 专业机构
  • 智能制造
  • 高级检索
  • 版权声明
  • 使用帮助

期刊


ISSN0953-5683
刊名IEE Review
参考译名英国电气工程师学会评论
收藏年代1998~2006

关联期刊参考译名收藏年代
Engineering & Technology英国工程技术学会工程和技术2006~2023


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006

2005, vol.51, no.1 2005, vol.51, no.10 2005, vol.51, no.11 2005, vol.51, no.2 2005, vol.51, no.3 2005, vol.51, no.4
2005, vol.51, no.5 2005, vol.51, no.6 2005, vol.51, no.7 2005, vol.51, no.8 2005, vol.51, no.9

题名作者出版年年卷期
EUROPE WON'T PAY FOR KNOWLEDGE ECONOMY - Spending on R&D in the EU is barely exceeding economic growthLuke Collins20052005, vol.51, no.9
SOFTLY, SOFTLY - Can subthreshold technology solve the escalating crisis in CMOS scaling?Roger Dettmer20052005, vol.51, no.9
TOW HEADS ARE BETTER THAN ONE - How will dual-core processors improve your desktop, and are they really needed?William Knight20052005, vol.51, no.9
SILICON SANDWICH TO GO - Wafer-scale manufacturing is the way forward when it comes to getting maximum benefits from system-in-package technologyFred van Roosmalen; Caroline Beelen-Hendrikx20052005, vol.51, no.9



制造业外文文献服务平台