期刊


ISSN1368-2148
刊名International Journal of Manufacturing Technology and Management
参考译名国际制造技术和管理杂志
收藏年代2000~2024



全部

2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024

2005, vol.7, no.1 2005, vol.7, no.2-4 2005, vol.7, no.5-6

题名作者出版年年卷期
Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresawLiqun Zhu; Imin Kao20052005, vol.7, no.5-6
In-process force monitoring for precision grinding semiconductor silicon wafersJeremiah A. Couey; Eric R. Marsh; Byron R. Knapp; R. Ryan Vallance20052005, vol.7, no.5-6
A novel fixed abrasive process: chemo-mechanical grinding technologyLibo Zhou; Jun Shimizu; Hiroshi Eda20052005, vol.7, no.5-6
Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of siliconM. B. Cai; X. P. Li; M. Rahman20052005, vol.7, no.5-6
Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variablesMuthukkumar S. Kadavasal; Abhijit Chandra; Sutee Eamkajornsiri; Ashraf -F. Bastawros20052005, vol.7, no.5-6
Effects of tool stiffness and infeed scheme on planarisation (Integrated model for simulation of planarisation process)Libo Zhou; Jun Shimizu; Hiroshi Eda20052005, vol.7, no.5-6
Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisationChangxue Wang; Peter Sherman; Abhijit Chandra20052005, vol.7, no.5-6
In-situ infrared detection and heating of metallic phase of silicon during scratching testLei Dong; John A. Patten; Jimmie A. Miller20052005, vol.7, no.5-6
Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission propertiesJ. M. Zhang; J. G. Sun20052005, vol.7, no.5-6
Fabrication of pin diodes using direct-bonded silicon wafersIqbal K. Bansal; Mark Surgent20052005, vol.7, no.5-6
12