期刊


ISSN0094-4289
刊名Journal of Engineering Materials and Technology
参考译名工程材料与工艺杂志;美国机械工程师学会汇刊
收藏年代1995~2024



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1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2024

2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Growth and Ordering of Si-Ge Quantum Dots on Strain Patterned SubstrA. Ramasubramaniam; V. B. Shenoy20052005, vol.127, no.4
Pseudoelasticity of Single Crystalline Cu Nanowires Through Reversible Lattice ReorientationsWuwei Liang; Min Zhou20052005, vol.127, no.4
Nonlocality Effect in Atomic Force Microscopy Measurement and Its Reduction by an Approaching MethodMing Hu; Haiying Wang; Mengfen Xia; Fujiu Ke; Yilong Bai20052005, vol.127, no.4
Structure and Properties of Electrocodeposited Cu-Al{sub}2O{sub}3 Nanocomposite Thin FilmsYong Gan; Yong Gan; Xi Chen; Jeffrey W. Kysar20052005, vol.127, no.4
Tetragonal Phase Transformation in Gold NanowiresKen Gall; Jiankuai Diao; Martin L. Dunn; Michael Haftel; Noam Bernstein; Michael J. Mehl20052005, vol.127, no.4
A Finite-Temperature Continuum Theory Based on Interatomic PotentialsH. Jiang; Y. Huang; K. C. Hwang20052005, vol.127, no.4
Coupled Atomistic/Discrete Dislocation Simulations of Nanoindentation at Finite TemperatureBehrouz Shiari; Ronald E. Miller; William A. Curtin20052005, vol.127, no.4
A Thermodynamic Framework for Viscoplasticity Based on Overstress (VBO)Richard B. Hall20052005, vol.127, no.4
Atomistic Determination of Continuum Mechanical Properties of Ion-Bombarded SiliconN. Kalyanasundaram; J. B. Freund; H. T. Johnson20052005, vol.127, no.4
Effect of Deformation Path Sequence on the Behavior of Nanoscale Copper Bicrystal InterfacesDouglas E. Spearot; Karl I. Jacob; David L. McDowell; Steven J. Plimpton20052005, vol.127, no.4
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