期刊


ISSN0094-4289
刊名Journal of Engineering Materials and Technology
参考译名工程材料与工艺杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2024

2005, vol.127, no.1 2005, vol.127, no.2 2005, vol.127, no.3 2005, vol.127, no.4

题名作者出版年年卷期
Growth and Ordering of Si-Ge Quantum Dots on Strain Patterned SubstrA. Ramasubramaniam; V. B. Shenoy20052005, vol.127, no.4
Pseudoelasticity of Single Crystalline Cu Nanowires Through Reversible Lattice ReorientationsWuwei Liang; Min Zhou20052005, vol.127, no.4
Nonlocality Effect in Atomic Force Microscopy Measurement and Its Reduction by an Approaching MethodMing Hu; Haiying Wang; Mengfen Xia; Fujiu Ke; Yilong Bai20052005, vol.127, no.4
Structure and Properties of Electrocodeposited Cu-Al{sub}2O{sub}3 Nanocomposite Thin FilmsYong Gan; Yong Gan; Xi Chen; Jeffrey W. Kysar20052005, vol.127, no.4
Tetragonal Phase Transformation in Gold NanowiresKen Gall; Jiankuai Diao; Martin L. Dunn; Michael Haftel; Noam Bernstein; Michael J. Mehl20052005, vol.127, no.4
A Finite-Temperature Continuum Theory Based on Interatomic PotentialsH. Jiang; Y. Huang; K. C. Hwang20052005, vol.127, no.4
Coupled Atomistic/Discrete Dislocation Simulations of Nanoindentation at Finite TemperatureBehrouz Shiari; Ronald E. Miller; William A. Curtin20052005, vol.127, no.4
A Thermodynamic Framework for Viscoplasticity Based on Overstress (VBO)Richard B. Hall20052005, vol.127, no.4
Atomistic Determination of Continuum Mechanical Properties of Ion-Bombarded SiliconN. Kalyanasundaram; J. B. Freund; H. T. Johnson20052005, vol.127, no.4
Effect of Deformation Path Sequence on the Behavior of Nanoscale Copper Bicrystal InterfacesDouglas E. Spearot; Karl I. Jacob; David L. McDowell; Steven J. Plimpton20052005, vol.127, no.4
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