期刊


ISSN0022-1481
刊名Journal of Heat Transfer
参考译名传热杂志；美国机械工程师学会汇刊
收藏年代1995～2022

关联期刊参考译名收藏年代
Journal of Heat and Mass Transfer传热与传质杂志：美国机械工程师学会汇刊2023～2024


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2005, vol.127, no.1 2005, vol.127, no.10 2005, vol.127, no.11 2005, vol.127, no.12 2005, vol.127, no.2 2005, vol.127, no.3
2005, vol.127, no.4 2005, vol.127, no.5 2005, vol.127, no.6 2005, vol.127, no.7 2005, vol.127, no.8 2005, vol.127, no.9

题名作者出版年年卷期
Next Generation Devices for Electronic Cooling With Heat Rejection to AirRalph L. Webb20052005, vol.127, no.1
Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin ColdwallsDonald C. Price; B. Elliott Short, Jr.20052005, vol.127, no.1
A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete HeatingLan Tang; Yogendra K. Joshi20052005, vol.127, no.1
A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding SolidEphraim M. Sparrow; John P. Abraham; Paul W. Chevalier20052005, vol.127, no.1
Coupled Field Analyses in MEMS With Finite Element AnalysisRavi Chandra Sikakollu; Lemmy Meekisho; Andres LaRosa20052005, vol.127, no.1
A Comparative Study of Cooling of High Power Density Electronics Using Sprays and MicrojetsMatteo Fabbri; Shanjuan Jiang; Vijay K. Dhir20052005, vol.127, no.1
Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit ArchitecturesJae-Mo Koo; Sungjun Im; Linan Jiang; Kenneth E. Goodson20052005, vol.127, no.1
Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic ApplicationsC. Bower; A. Ortega; P. Skandakumaran; R. Vaidyanathan; T. Phillips20052005, vol.127, no.1
Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux ElectronicsCristina H. Amon; S.-C. Yao; C.-F. Wu; C.-C. Hsieh20052005, vol.127, no.1
An Assessment of Module Cooling Enhancement With Thermoelectric CoolersR. E. Simons; M. J. Ellsworth; R. C. Chu20052005, vol.127, no.1
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