期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2005, vol.5, no.1 2005, vol.5, no.10 2005, vol.5, no.2 2005, vol.5, no.3 2005, vol.5, no.4 2005, vol.5, no.5
2005, vol.5, no.6 2005, vol.5, no.7 2005, vol.5, no.8 2005, vol.5, no.9

题名作者出版年年卷期
Lead-free (LF) wave-soldering: Can (should) it be eliminatedWerner Engelmaier20052005, vol.5, no.9
Ultra-fine pitch solder pastes for flip-chip assembly applications - understanding and overcoming sub-process challengesSteve Dowds20052005, vol.5, no.9
Electronic equipment outlook: Not all that bad in spite of a softening economy & rising energy costsWalt Custer20052005, vol.5, no.9
Lead-free BGA reliability: high-speed bondtesting and brittle fracture detectionBob Sykes20052005, vol.5, no.9
Lead-free soldering for automotive applications - meeting the reliability requirementViktor Tiedeile; Joerg Mahrle20052005, vol.5, no.9
Theory closes in on causes of tin whiskersGeorge Galyon; Larry Palmer; Ron Gedney20052005, vol.5, no.9
Printed circuit board reliability: Needed PCB design changes for lead-free solderingWerner Engelmaier20052005, vol.5, no.8
Electronics and energyAlan Rae20052005, vol.5, no.8
Driving motor technology forward for 21st century placement challengesKoen Gieskes20052005, vol.5, no.8
Soaring energy costs + digital age = modest growthWalt Custer20052005, vol.5, no.8
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