知识中心主页
文献服务
文献资源
外文期刊
外文会议
专业机构
智能制造
高级检索
版权声明
使用帮助
期刊
ISSN
0946-7076
刊名
Microsystem technologies
参考译名
微系统技术:传感器,致动器与系统集成
收藏年代
1998~2024
关联期刊
参考译名
收藏年代
Journal of Information Storage and Processing Systems
存储与处理系统信息杂志
2000~2001
全部
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2006, vol.12, no.10-11
2006, vol.12, no.12
2006, vol.12, no.3
2006, vol.12, no.4
2006, vol.12, no.5
2006, vol.12, no.6
2006, vol.12, no.7
2006, vol.12, no.8
2006, vol.12, no.9
题名
作者
出版年
年卷期
Surface plasma treatments enabling low temperature direct bonding
Hubert Moriceau; Francois Rieutord; Christophe Morales; Anne Marie Charvet
2006
2006, vol.12, no.5
Effect of interfacial SiO{sub}2 thickness for low temperature O{sub}2 plasma activated wafer bonding
Benoit Olbrechts; Xuanxiong Zhang; Yannick Bertholet; Thomas Pardoen; Jean-Pierre Raskin
2006
2006, vol.12, no.5
Direct bonding with on-wafer metal interconnections
C. Jia; M. Wiemer; T. Gessner
2006
2006, vol.12, no.5
Wafer direct bonding with ambient pressure plasma activation
Markus Gabriel; Brad Johnson; Ralf Suss; Manfred Reiche; Marko Eichler
2006
2006, vol.12, no.5
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)
H. Luoto; T. Suni; M. Kulawski; K. Henttinen; H. Kattelus
2006
2006, vol.12, no.5
Bonded thick film SOI with pre-etched cavities
Tommi Suni; Kimmo Henttinen; James Dekker; Hannu Luoto; Martin Kulawski; Jari Makinen; Risto Mutikainen
2006
2006, vol.12, no.5
Discussion of tooling solutions for the direct bonding of silicon wafers
Nick Aitken; Tony Rogers
2006
2006, vol.12, no.5
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
Alexander Doll; Martin Rabold; Frank Goldschmidtboing; Peter Woias
2006
2006, vol.12, no.5
Influence of the frequency on fatigue of directly wafer-bonded silicon
Jorg Bagdahn; Michael Bernasch; Matthias Petzold
2006
2006, vol.12, no.5
Fabrication of microfluidic networks with integrated electrodes
D. C. Hermes; T. Heuser; E. J. van der Wouden; J. G. E. Gardeniers; A. van den Berg
2006
2006, vol.12, no.5
1
2
制造业外文文献服务平台