期刊


ISSN0013-4686
刊名Electrochimica Acta
参考译名国际电化学杂志:电化学学报
收藏年代1998~2024



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2008, vol.53, no.10 2008, vol.53, no.11 2008, vol.53, no.12 2008, vol.53, no.13 2008, vol.53, no.14 2008, vol.53, no.15
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2008, vol.54, no.1 2008, vol.54, no.2

题名作者出版年年卷期
The structural evolution and lithiation behavior of vacuum-deposited Si film with high reversible capacityT. Zhang; H. P. Zhang; L. C. Yang; B. Wang; Y. P. Wu; T. Takamura20082008, vol.53, no.18
Electrochemical characterisation of patterned carbon nanotube electrodes on silane modified siliconBenjamin S. Flavel; Jingxian Yu; Joseph G. Shapter; Jamie S. Quinton20082008, vol.53, no.18
Pitting corrosion of Al and Al-Cu alloys by (ClO{sub}4){sup}- ions in neutral sulphate solutionsMohammed A. Amin; Sayed S. Abd El Rehim; S. O. Moussa; Abdallah S. Ellithy20082008, vol.53, no.18
Multifunctional hybrid coating on titanium towards hydroxyapatite growth: Electrodeposition of tantalum and its molecular functionalization with organophosphonic acids filmsChristelle Arnould; Joseph Delhalle; Zineb Mekhalif20082008, vol.53, no.18
Electrodeposition of iron-palladium thin filmsS. C. Hernandez; B. Y. Yoo; E. Stefanescu; S. Khizroev; N. V. Myung20082008, vol.53, no.18
Development of structural characterization and physicochemical behaviour of triphenylamine blocksKrzysztof Idzik; Jadwiga Soloducho; Mieczyslaw Lapkowski; Sylwia Golba20082008, vol.53, no.18
Cu micropatterning on n-Si(111) by selective electrochemical deposition using an agarose stampJing Tang; Jin L. Zhuang; Li Zhang; Wen H. Wang; Zhao W. Tian20082008, vol.53, no.18
New degradation mechanism of Ti/IrO{sub}2 + MnO{sub}2 anode for oxygen evolution in 0.5 M H{sub}2SO{sub}4 solutionZhi-Guo Ye; Hui-Min Meng; Dong-Bai Sun20082008, vol.53, no.18
CueO-immobilized porous carbon electrode exhibiting improved performance of electrochemical reduction of dioxygen to waterSeiya Tsujimura; Yuko Miura; Kenji Kano20082008, vol.53, no.18
Improved surfaced-enhanced Raman scattering based on electrochemically roughened silver substrates modified through argon plasma treatmentChee-Chan Wang; Jr-Shiuan Chen20082008, vol.53, no.18
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