期刊


ISSN0924-0136
刊名Journal of Materials Processing Technology
参考译名材料加工技术杂志
收藏年代1998～2024



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2008, vol.195, no.1-3 2008, vol.196, no.1-3 2008, vol.197, no.1-3 2008, vol.198, no.1-3 2008, vol.199, no.1-3 2008, vol.200, no.1-3
2008, vol.201, no.1-3 2008, vol.202, no.1-3 2008, vol.203, no.1-3 2008, vol.204, no.1-3 2008, vol.205, no.1-3 2008, vol.206, no.1-3
2008, vol.207, no.1-3 2008, vol.208, no.1-3

题名作者出版年年卷期
Effect of water spray on friction and wear behaviour of noncommercial and commercial brake pad materialsN. S. M. El-Tayeb; K. W. Liew20082008, vol.208, no.1-3
Microwave synthesis of high dielectric constant CaCu{sub}3Ti{sub}4O{sub}12Hongtao Yu; Hanxing Liu; Dabing Luo; Minghe Cao20082008, vol.208, no.1-3
Improvement of shape memory effect in an Fe-Mn-Si-Cr-Ni alloy fabricated by equal channel angular pressingZhang Wei; Jiang Laizhu; Li Ning; Wen Yuhua20082008, vol.208, no.1-3
An improved computation model for critical bending force of three-jaw chucksP. F. Feng; Z. J. Wu; D. W. Yu; E. Uhlmann20082008, vol.208, no.1-3
Fabrication of self-encapsulated nickel microchannels and nickel nanowalls by reactive ion etchingPhill Gu Jung; Im Deok Jung; Sang Min Lee; Jong Soo Ko20082008, vol.208, no.1-3
Plasma electrolytic deposition of titanium dioxide nanorods and nano-particlesThierry Paulmier; John M. Bell; Peter M. Fredericks20082008, vol.208, no.1-3
Grading of softwood lumber using non-destructive techniquesSong-Yung Wang; Jin-Hau Chen; Ming-Jer Tsai; Cheng-Jung Lin; Te-Hsin Yang20082008, vol.208, no.1-3
Cutting edge preparation using magnetic polishing and its influence on the performance of high-speed steel drillsF. Y. Cheung; Z. F. Zhou; A. Geddam; K. Y. Li20082008, vol.208, no.1-3
The effect of multiphase nitride inclusions on the surface roughness of 2083 plastic moldsGuan Yingchun; Tang Guoyi; Wan Junxi; Ye Qiang; Mamoru Mizuno; Wu Yongbo20082008, vol.208, no.1-3
Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperatureYanhong Tian; Chunqing Wang; Ivan Lum; M. Mayer; J. P. Jung; Y. Zhou20082008, vol.208, no.1-3
12345678910...



制造业外文文献服务平台