期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
Technology preview: National Electronics WeekTrevor Galbraith20082008, vol.8, no.5
Nanotechnology and mathematical methods for high-performance thermal interface materialsSara N. Paisner20082008, vol.8, no.5
Wafer-level cavity package with via-through-pad interconnectsGiles Humpston20082008, vol.8, no.5
Improving print performance using area ratio sensitivity analysisChris Anglin20082008, vol.8, no.5
Ball grid array & lead-free assembly defects, part 1Bob Wills20082008, vol.8, no.5
Tools & Methods for Lean Production Management in EAT. Nguyen; Vern Harrison20082008, vol.8, no.5



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