期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


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1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2009, vol.15, no.1 2009, vol.15, no.10/11 2009, vol.15, no.12 2009, vol.15, no.2 2009, vol.15, no.3 2009, vol.15, no.4
2009, vol.15, no.5 2009, vol.15, no.6 2009, vol.15, no.7 2009, vol.15, no.8 2009, vol.15, no.9

题名作者出版年年卷期
A silicon test chip for the thermomechanical analysis of MEMS packagingsSoeren Majcherek; Thomas Leneke; Soeren Hirsch20092009, vol.15, no.1
Macroscopic invisible cablesNicola M. Pugno20092009, vol.15, no.1
Poly-Si extensions and etching residues as a reliability riskPeter Jacob20092009, vol.15, no.1
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsTomasz Falat; Kazimierz Friedel; Norman Marenco; Stephan Warnat20092009, vol.15, no.1
Changes in the microstructure of materials and their impact on reliability: experiments and modelingAndreas Brandmair; Thomas Bohme; Wolfgang H. Muller20092009, vol.15, no.1
Assessment of testing methodologies for thin-film vacuum MEMS packagesQian Li; Hans Goosen; Fred van Keulen; Joost van Beek; Guoqi Zhang20092009, vol.15, no.1
Design limitations related to conductive anodic filament formation in a micro-worldAntonio Caputo; Laura J. Turbini; Doug D. Perovic20092009, vol.15, no.1
Interlayer cooling potential in vertically integrated packagesT. Brunschwiler; B. Michel; H. Rothuizen; U. Kloter; B. Wunderle; H. Oppermann; H. Reichl20092009, vol.15, no.1
How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experimentsW. H. Muller; H. Worrack; J. Sterthaus; J. Villain; J. Wilden; A. Juritza20092009, vol.15, no.1
Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramicsShouwen Yu; Li Yu20092009, vol.15, no.1
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