期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2009, vol.15, no.1 2009, vol.15, no.10/11 2009, vol.15, no.12 2009, vol.15, no.2 2009, vol.15, no.3 2009, vol.15, no.4
2009, vol.15, no.5 2009, vol.15, no.6 2009, vol.15, no.7 2009, vol.15, no.8 2009, vol.15, no.9

题名作者出版年年卷期
Effects of dielectric charging on MEMS-based grating light modulatorJ. Zhang; J. Y. Sun; Z. H. Zhang; Y. Zhu20092009, vol.15, no.5
Design and simulation of a normally closed glucose sensitive hydrogel based microvalveMasoomeh Tehranirokh; Burhanuddin Yeop Majlis; Badariah Bais20092009, vol.15, no.5
Analysis of the nonlinear dynamic stability for an electrically actuated viscoelastic microbeamY. M. Fu; J. Zhang; R. G. Bi20092009, vol.15, no.5
High standoff dual-mode-actuation MEMS switchesY. Choi; M. G. Allen; K. Kim20092009, vol.15, no.5
A hybrid surface tension seal for pneumatic and hydraulic microactuatorsM. F. L. De Volder; D. Reynaerts20092009, vol.15, no.5
Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machiningD. Rakwal; S. Heamawatanachai; E. Bamberg; P. Tathireddy; F. Solzbacher20092009, vol.15, no.5
Analysis of the friction processes in ultrasonic wedge/wedge-bondingH. Gaul; H. Reichl; M. Schneider-Ramelow20092009, vol.15, no.5
Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnectS.-H. Choa20092009, vol.15, no.5
Analysis and design of a wide micro beam as a pressure gauge for high sensitivity MEMS fingerprint sensorsM. Damghanian; B. Y. Majlis20092009, vol.15, no.5
Current micropump technologies and their biomedical applicationsFarid Amirouche; Yu Zhou; Tom Johnson20092009, vol.15, no.5
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