期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2009, vol.131, no.1 2009, vol.131, no.2 2009, vol.131, no.3 2009, vol.131, no.4

题名作者出版年年卷期
Modeling Forced Convection in Finned Metal Foam Heat SinksChristopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen20092009, vol.131, no.2
Electromigration Reliability of 96.5Sn-3Ag-0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad MetallizationYi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee20092009, vol.131, no.2
Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading TestKen-ichi Ohguchi; Katsuhiko Sasaki; Setsuo Aso20092009, vol.131, no.2
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free SoldersZongjie Han; Songbai Xue; Jianxin Wang; Xin Zhang; Shenglin Yu; Liang Zhang20092009, vol.131, no.2
Thermal Optimization of a MicroChannel Heat Sink With Trapezoidal Cross SectionAfzal Husain; Kwang-Yong Kim20092009, vol.131, no.2
A Novel Projection Moire System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow ProcessReinhard E. Powell; I. Charles Ume20092009, vol.131, no.2
High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional ModulesYutaka Kumano; Toru Yamada; Tetsuyoshi Ogura20092009, vol.131, no.2
Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H{sub}2O-Al{sub}2O{sub}3 NanofluidsT. L. Bergman20092009, vol.131, no.2
Analytical Modeling for Thermodynamic Characterization of Data Center Cooling SystemsMadhusudan Iyengar; Roger Schmidt20092009, vol.131, no.2
Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-FinsChristopher A. Konishi; Weilin Qu; Frank E. Pfefferkorn20092009, vol.131, no.2
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