期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
Creating flexible circuit assemblies without solderJoe Fjelstad20092009, vol.9, no.12
Investigation and development of tin-lead and lead-free solder pastes to reduce head-in-pillow defectsJasbir Bath; Roberto Garcia; Hajime Takahashi; Gordon Clark; Manahu Itoh; Koki Solder20092009, vol.9, no.12
China's export trade for gray-market handsetsKevin Wang20092009, vol.9, no.12
Combating counterfeit components-industry initiatives for a global problemNigel Burtt20092009, vol.9, no.12
Year end assessment: the path to recoveryWalt Custer; Jon Custer-Topai20092009, vol.9, no.12
Case Study: Traceability at SemecsTrevor Galbraith20092009, vol.9, no.12
Measuring package on package-possible procedure, comments welcomeBob Willis20092009, vol.9, no.12



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