期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
General guide to solder balls in wave soldering - now you see them, now you don'tBob Willis20092009, vol.9, no.2
Strain gage testing: the delta effect of thermal cycle testingMark T. McMeen20092009, vol.9, no.2
Resolution of solder voids in pin-in-hole productCondia Yu; Eddie W. W. Tang; Jack To; Ka Wai Chan; Brian Carlson; Rick Chen; P. S. Hou; Phil Isaacs; Eddie Kobeda; Sunil Nigam; Jeffrey Taylor20092009, vol.9, no.2
A new angle on printingGeorge Babka; Scott Zerkle; Frank Andres; Rahul Raut; Westin Bent; Dave Connell20092009, vol.9, no.2



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