期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
IC packaging technology retrospective - Part 4Joe Fjelstad20092009, vol.9, no.6
RoHS war storiesBev Christian; Michael Fry20092009, vol.9, no.6
Energy measurement: The main metric for high strain rate bond testing of solder ballsStephen Clark20092009, vol.9, no.6
A revolution in wave solderingPeter Grundy20092009, vol.9, no.6
Case Study: A successful model for PCB fabrication in an ever-changing marketTrevor Galbraith20092009, vol.9, no.6



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