期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Evaluation of Transverse Shear Effect on Film Delamination in Blister TestWei Wang; Yong Huang; Nicole Coutris; Hongseok Noh; Peter J. Hesketh20102010, vol.132, no.1
High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating LayerMyung Jin Yim; Yi Li; Kyoung Sik Moon; C. P. Wong20102010, vol.132, no.1
Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array ArrangementM. K. Abdullah; M. Z. Abdullah; M. A. Mujeebu; Horizon Gitano; Z. M. Ariff; R. Razali; K. A. Ahmad20102010, vol.132, no.1
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale PackagesJie-Hua Zhao; Vikas Gupta; Alok Lohia; Darvin Edwards20102010, vol.132, no.1
Electromigration Simulation for Metal LinesJianPing Jing; Lihua Liang; Guang Meng20102010, vol.132, no.1
An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated ChipCheng-Hung Huang; Wei-Lun Chang20102010, vol.132, no.1
Design of a Static TIM TesterV. Szekely; E. Kollar; G. Somlay; P. G. Szabo; M. Rencz20102010, vol.132, no.1
Numerical and Experimental Study of Interface Delamination in Flip Chip BGA PackageHu Guojun; Andrew A. O. Tay; Luan Jing-En; Ma Yiyi20102010, vol.132, no.1
Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding ProcessMasaaki Koganemaru; Toru Ikeda; Noriyuki Miyazaki; Hajime Tomokage20102010, vol.132, no.1



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