制造业外文文献服务平台 | foreigndata.cmes.org | 全球机械文献资源网

期刊

ISSN	1474-0893
刊名	Global SMT & Packaging
参考译名	全球表面装配技术与包装——欧洲版
收藏年代	2004～2025

关联期刊	参考译名	收藏年代
Test	试验

全部

2004	2005	2006	2007	2008	2009
2010	2011	2012	2013	2016	2017
2018	2019	2020	2021	2022	2023
2024	2025

2010, vol.10, no.10	2010, vol.10, no.11	2010, vol.10, no.12	2010, vol.10, no.2	2010, vol.10, no.3	2010, vol.10, no.4
2010, vol.10, no.5	2010, vol.10, no.6	2010, vol.10, no.7	2010, vol.10, no.8	2010, vol.10, no.9

题名	作者	出版年	年卷期
Reliability - keystone of a sustainable electronics industry	Joe Fjelstad	2010	2010, vol.10, no.4
PCB assembly system set-up for package-on-package (PoP) assembly	Gerry Padnos	2010	2010, vol.10, no.4
Addressing package advancement challenges with innovative contactor probe technology	Tony DeRosa	2010	2010, vol.10, no.4
New opportunities for controlling pressure in flip chip assembly	George A. Riley	2010	2010, vol.10, no.4
'Pad cratering' & 'trace buckling' - new failure modes created by Pb-free soldering	Werner Engelmaier	2010	2010, vol.10, no.4
Online training & education - the alternative way	Bob Willis	2010	2010, vol.10, no.4

制造业外文文献服务平台