期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
Raised copper contact technologies for IC packaging - a path to improved reliabilityJoe Fjelstad20102010, vol.10, no.9
Predicting PCB delamination in lead-free assemblyGeert Willems; Piet Watte20102010, vol.10, no.9
Fast heat-curing adhesives for packagingKarl Blitzer; Rene Tobisch-Haupt20102010, vol.10, no.9
A better dispense tipFrank Murch; Eiji Ito20102010, vol.10, no.9
Case study: Agile EMS provider delivers tier-one information and controlJason Spera20102010, vol.10, no.9



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