期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2025



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024 2025

2011, vol.13, no.1 2011, vol.13, no.2 2011, vol.13, no.3 2011, vol.13, no.4

题名作者出版年年卷期
Scanning Capacitance Microscopy (SCM) Applications in Failure AnalysisXiang-Dong Wang20112011, vol.13, no.4
FEI Launches Plasma FIB SystemRose M. Ring20112011, vol.13, no.4
FEI Announces Versa 3D DualBeam Imaging and Analysis SystemRose M. Ring20112011, vol.13, no.4
What Is 3-D Test and How Do IEEE Standards Help?Al Crouch; Jennifer Dworak20112011, vol.13, no.4
FEI Releases Titan G2 80-200 with ChemiSTEM TechnologyRose M. Ring20112011, vol.13, no.4
CRAIC's 20/20XL Offers Nondestructive Film-Thickness MeasurementRose M. Ring20112011, vol.13, no.4
Olympus Releases Stream v1.6 Microscope SoftwareRose M. Ring20112011, vol.13, no.4
Siemens' System Analyzes Frequency Converter ModulesRose M. Ring20112011, vol.13, no.4
DCG Systems Acquires Thermosensorik GmbHRose M. Ring20112011, vol.13, no.4
The Failure Analysis Lab behind the Foundry BusinessJones Chung20112011, vol.13, no.4



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