期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
A few "Design For" pearls of wisdomKeith Bryant20122012, vol.12, no.9
Microelectronic miniaturization: The march to the bottom continues - should it?Joe Fjelstad20122012, vol.12, no.9
Trends 2012: RestoringTrevor Galbraith20122012, vol.12, no.9
Rising markets for ICsSandra Winkler20122012, vol.12, no.9
Transforming quality and production information infrastructureTrevor Galbraith20122012, vol.12, no.9
Monitoring the recovery... Patience may be requiredWalt Custer; Jon Custer-Topai20122012, vol.12, no.9
Quality and automaton are the theme in ShenzhenTrevor Galbraith20122012, vol.12, no.9
Quality control methods used to ensure the production of reliable assembliesDavid Lober; John M. Williamson; Mike Bixenman20122012, vol.12, no.9
Lean manufacturing and DFx: Best practices and tradeoffsChris Munroe20122012, vol.12, no.9
Overcoming the challenges of lead-free wave solderingAlbrecht Beck20122012, vol.12, no.8
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