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期刊
ISSN
0946-7076
刊名
Microsystem technologies
参考译名
微系统技术:传感器,致动器与系统集成
收藏年代
1998~2024
关联期刊
参考译名
收藏年代
Journal of Information Storage and Processing Systems
存储与处理系统信息杂志
2000~2001
全部
1998
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2013, vol.19, no.1
2013, vol.19, no.11
2013, vol.19, no.12
2013, vol.19, no.2
2013, vol.19, no.3
2013, vol.19, no.4
2013, vol.19, no.5
2013, vol.19, no.6
2013, vol.19, no.7
2013, vol.19, no.8
2013, vol.19, no.9/10
题名
作者
出版年
年卷期
Application of photo-etching of polytetrafluoroethylene induced by high energy synchrotron radiation to LIGA
Hideki Kido; Tomoyuki Kuroki; Masaaki Okubo; Yuichi Utsumi
2013
2013, vol.19, no.3
Fabrication of high precision microstructure using ICP etching for capacitive inclination sensor
Daiji Noda; Yuu Kuboyama; Tadashi Hattori
2013
2013, vol.19, no.3
Fabrication of glass-like carbon molds to imprint on glass materials by MEMS processing technologies
Harutaka Mekaru; Chieko Okuyama; Akihisa Ueno
2013
2013, vol.19, no.3
Effect of buffer materials on thermal imprint on plastic optical fiber
Harutaka Mekaru; Akihiro Ohtomo; Hideki Takagi
2013
2013, vol.19, no.3
3D deep X-ray lithography for producing a multi-channel Fourier transform interferometer
Sascha P. Heussler; Herbert O. Moser; S. M. P. Kalaiselvi
2013
2013, vol.19, no.3
Manufacture of a micro-sized piezoelectric ceramic structure using a sacrificial polymer mold insert
Jong Hyun Kim; Si-Young Choi; Jae-Ho Jeon; Geunbae Lim; Suk Sang Chang
2013
2013, vol.19, no.3
Fabrication of 3-D PTFE microstructures utilising change of etching rate with respect to exposure time
Mitsuhiro Horade; Susumu Sugiyama
2013
2013, vol.19, no.3
Influence of developer temperature on the shape of structures fabricated by deep X-ray lithography
Mitsuhiro Horade; Susumu Sugiyama
2013
2013, vol.19, no.3
Deposition property investigation of a focused ion beam for a high-aspect-ratio metal tip
Dae Keun Choi; Sang Hoon Lee
2013
2013, vol.19, no.3
Obstacles for cognitive analogy in analysis and synthesis in microsystems development
Albert Albers; Peter Borsting; Sven Matthiesen
2013
2013, vol.19, no.3
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