期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2013, vol.19, no.1 2013, vol.19, no.11 2013, vol.19, no.12 2013, vol.19, no.2 2013, vol.19, no.3 2013, vol.19, no.4
2013, vol.19, no.5 2013, vol.19, no.6 2013, vol.19, no.7 2013, vol.19, no.8 2013, vol.19, no.9/10

题名作者出版年年卷期
Direct bonding of titanium layers on siliconF. Baudin; L. Di Cioccio; V. Delaye; N. Chevalier; J. Dechamp; H. Moriceau; E. Martinez; Y. Brechet20132013, vol.19, no.5
Aluminum-germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodesChristian Gossler; Michael Kunzer; Mario Baum; Maik Wiemer; Rudiger Moser; Thorsten Passow; Klaus Kohler; Ulrich T. Schwarz; Joachim Wagner20132013, vol.19, no.5
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integrationJ. Fan; D. F. Lim; L. Peng; K. H. Li; C. S. Tan20132013, vol.19, no.5
Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packagingAnselm Wissinger; Alexander Olowinsky; Arnold Gillner; Reinhart Poprawe20132013, vol.19, no.5
Hydrophobic direct bonding of silicon reconstructed surfacesC. Rauer; F. Rieutord; J. M. Hartmann; A. M. Charvet; F. Fournel; D. Mariolle; C. Morales; H. Moriceau20132013, vol.19, no.5
Room temperature bonding for vacuum applications: climatic and long time testsS. Langa; J. Utsumi; T. Ludewig; C. Drabe20132013, vol.19, no.5
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopyFalk Naumann; Sebastian Brand; Michael Bernasch; Sebastian Tismer; Peter Czurratis; Dirk Wunsch; Matthias Petzold20132013, vol.19, no.5
Characterization of bonded wafer stacks by use of the photoelastic-analysis-methodH. Geiler; K. Schulz; R. Knechtel20132013, vol.19, no.5
The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafersV. Masteika; J. Kowal; N. St. J. Braitwaite; T. Rogers20132013, vol.19, no.5
Optimization of MEMS capacitive accelerometerMourad Benmessaoud; Mekkakia Maaza Nasreddine20132013, vol.19, no.5
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