期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2013, vol.135, no.1 2013, vol.135, no.2 2013, vol.135, no.3 2013, vol.135, no.4

题名作者出版年年卷期
Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic ModulePeng Wang; Patrick McCluskey; Avram Bar-Cohen20132013, vol.135, no.2
Study on Heat Conduction in a Simulated Multicore Processor Chip - Part I: Analytical ModelingWataru Nakayama20132013, vol.135, no.2
Study on Heat Conduction in a Simulated Multicore Processor Chip - Part II: Case StudiesWataru Nakayama20132013, vol.135, no.2
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder JointsOusama M. Abdelhadi; Leila Ladani20132013, vol.135, no.2
Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat PipesKambiz Jahani; Maziar Mohammadi; Mohammad Behshad Shafii; Zahra Shiee20132013, vol.135, no.2
Effect of Indium Content on the Melting Point, Dross, and Oxidation Characteristics of Sn-2Ag-3Bi-xln SoldersAe-Jeong Jeon; Seong-Jun Kim; Sang-Hoon Lee; Chung-Yun Kang20132013, vol.135, no.2
Development of Accelerated Method for Thermal Cycling in Electronic Packaging ApplicationMichael Mayer; Michael McCracken; John Persic20132013, vol.135, no.2
Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic CoolingGongnan Xie; Jian Liu; Yanquan Liu; Bengt Sunden; Weihong Zhang20132013, vol.135, no.2
Application of Kriging and Radial Basis Function for Reliability Optimization in Power ModulesPushparajah Rajaguru; Stoyan Stoyanov; Hua Lu; Chris Bailey20132013, vol.135, no.2
Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor PackagingC. L. Gan; U. Hashim20132013, vol.135, no.2
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