期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告:可靠性
收藏年代2000~2024



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题名作者出版年年卷期
ビアプログラマブルアナログ(VPA)回路設計とプログラマブルアナログ回路との性能比較上田佳祐; 堀遼平; 汐崎充; 熊本敏夫; 藤田智弘; 藤野毅20132013, vol.113, no.322
耐タンパ性向上のためのHybrid Masking Dual-Rail ROMを用いたAES暗号回路の性能評価鵜飼慎太郎; 中井綱人; 北村俊樹; 久保田貴也; 汐崎充; 藤野毅20132013, vol.113, no.322
サイドチャネル攻撃耐性を持つIO-Masked Dual-Rail ROMに統合可能なPUF回路の検討と設計西村隆志; 菅谷周平; 竹内章浩; 汐崎充; 藤野毅20132013, vol.113, no.322
最適周波数および最適電圧を検出する量子化デコーダの開発とこれを応用したDVPS制御形動きベクトル検出プロセッサの開発小林伸彰; 榎本忠儀20132013, vol.113, no.322
フレームレートの動的最適化に基づく低消費エネルギー物体追跡システムの提案江川瀬里奈; 井上弘士20132013, vol.113, no.322
MTJ素子を用いた不揮発FPGAの電力効率最適化手法鈴木大輔; 夏井雅典; 望月明; 羽生貴弘20132013, vol.113, no.322
TSVを用いた3次元積層向け回路技術の開発長田健一; 古田太; 武田健一20132013, vol.113, no.322
3D/2.5D実装向けチップ間接続微細配線技術谷元昭; 中田義弘; 神吉剛司; 中村友二20132013, vol.113, no.322
チップ積層パッケージのためのチップ薄化技術田久真也; 黒澤哲也20132013, vol.113, no.322
チップ電源網を考慮したノイズ低減のための協調設計小林遼太; 大塚央記; 久保元樹; 清重翔; 市村航; 寺崎正洋; 須藤俊夫20132013, vol.113, no.322
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