期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：可靠性
收藏年代2000～2024



全部

2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024

2013, vol.113, no.1 2013, vol.113, no.100 2013, vol.113, no.107 2013, vol.113, no.11 2013, vol.113, no.110 2013, vol.113, no.112
2013, vol.113, no.116 2013, vol.113, no.118 2013, vol.113, no.119 2013, vol.113, no.12 2013, vol.113, no.126 2013, vol.113, no.128
2013, vol.113, no.13 2013, vol.113, no.134 2013, vol.113, no.135 2013, vol.113, no.141 2013, vol.113, no.142 2013, vol.113, no.143
2013, vol.113, no.144 2013, vol.113, no.149 2013, vol.113, no.15 2013, vol.113, no.153 2013, vol.113, no.162 2013, vol.113, no.163
2013, vol.113, no.164 2013, vol.113, no.167 2013, vol.113, no.17 2013, vol.113, no.171 2013, vol.113, no.172 2013, vol.113, no.173
2013, vol.113, no.174 2013, vol.113, no.177 2013, vol.113, no.185 2013, vol.113, no.186 2013, vol.113, no.187 2013, vol.113, no.188
2013, vol.113, no.189 2013, vol.113, no.19 2013, vol.113, no.190 2013, vol.113, no.195 2013, vol.113, no.199 2013, vol.113, no.201
2013, vol.113, no.202 2013, vol.113, no.204 2013, vol.113, no.216 2013, vol.113, no.217 2013, vol.113, no.224 2013, vol.113, no.225
2013, vol.113, no.228 2013, vol.113, no.231 2013, vol.113, no.232 2013, vol.113, no.235 2013, vol.113, no.236 2013, vol.113, no.238
2013, vol.113, no.242 2013, vol.113, no.247 2013, vol.113, no.249 2013, vol.113, no.250 2013, vol.113, no.251 2013, vol.113, no.253
2013, vol.113, no.26 2013, vol.113, no.260 2013, vol.113, no.261 2013, vol.113, no.263 2013, vol.113, no.264 2013, vol.113, no.268
2013, vol.113, no.27 2013, vol.113, no.271 2013, vol.113, no.272 2013, vol.113, no.278 2013, vol.113, no.283 2013, vol.113, no.284
2013, vol.113, no.289 2013, vol.113, no.290 2013, vol.113, no.296 2013, vol.113, no.298 2013, vol.113, no.299 2013, vol.113, no.30
2013, vol.113, no.307 2013, vol.113, no.313 2013, vol.113, no.317 2013, vol.113, no.319 2013, vol.113, no.320 2013, vol.113, no.322
2013, vol.113, no.323 2013, vol.113, no.326 2013, vol.113, no.330 2013, vol.113, no.331 2013, vol.113, no.333 2013, vol.113, no.337
2013, vol.113, no.341 2013, vol.113, no.342 2013, vol.113, no.343 2013, vol.113, no.347 2013, vol.113, no.348 2013, vol.113, no.349
2013, vol.113, no.350 2013, vol.113, no.351 2013, vol.113, no.352 2013, vol.113, no.354 2013, vol.113, no.359 2013, vol.113, no.365
2013, vol.113, no.369 2013, vol.113, no.370 2013, vol.113, no.379 2013, vol.113, no.383 2013, vol.113, no.394 2013, vol.113, no.395
2013, vol.113, no.396 2013, vol.113, no.397 2013, vol.113, no.40 2013, vol.113, no.401 2013, vol.113, no.41 2013, vol.113, no.411
2013, vol.113, no.412 2013, vol.113, no.413 2013, vol.113, no.416 2013, vol.113, no.419 2013, vol.113, no.420 2013, vol.113, no.425
2013, vol.113, no.426 2013, vol.113, no.427 2013, vol.113, no.433 2013, vol.113, no.437 2013, vol.113, no.438 2013, vol.113, no.439
2013, vol.113, no.44 2013, vol.113, no.440 2013, vol.113, no.445 2013, vol.113, no.448 2013, vol.113, no.45 2013, vol.113, no.450
2013, vol.113, no.451 2013, vol.113, no.454 2013, vol.113, no.460 2013, vol.113, no.462 2013, vol.113, no.463 2013, vol.113, no.467
2013, vol.113, no.468 2013, vol.113, no.47 2013, vol.113, no.474 2013, vol.113, no.477 2013, vol.113, no.48 2013, vol.113, no.481
2013, vol.113, no.483 2013, vol.113, no.484 2013, vol.113, no.486 2013, vol.113, no.49 2013, vol.113, no.491 2013, vol.113, no.501
2013, vol.113, no.503 2013, vol.113, no.53 2013, vol.113, no.58 2013, vol.113, no.68 2013, vol.113, no.69 2013, vol.113, no.70
2013, vol.113, no.72 2013, vol.113, no.73 2013, vol.113, no.74 2013, vol.113, no.77 2013, vol.113, no.78 2013, vol.113, no.80
2013, vol.113, no.81 2013, vol.113, no.82 2013, vol.113, no.87 2013, vol.113, no.96 2013, vol.113, no.97 2013, vol.113, no.99

题名作者出版年年卷期
15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique - for Advanced Chip Stacking ApplicationsMasahiro AOYAGI; Thanh-Tung BUI; Fumiki KATO; Naoya WATANABE; Shunsuke NEMOTO; Katsuya KIKUCHI20132013, vol.113, no.451
三次元積層向けウェハの裏面研削によるダメージ評価水島賢子; 金永ソク; 中村友二; 杉江隆一; 橋本秀樹; 上殿明良; 大場隆之20132013, vol.113, no.451
大口径中性粒子ビームCVDを用いたノンポーラスULK-SiOCH膜菊地良幸; 寒川誠二20132013, vol.113, no.451
TSVの高速形成に向けた有機系導電インクの注入手法川喜多仁20132013, vol.113, no.451
集積回路のこれから－社会の動きを考えてみる益一哉20132013, vol.113, no.451
インプラント法によるカーボンナノチューブプラグの作製とスパッタアニール法による多層グラフェン配線の接合佐藤元伸; 高橋慎; 二瓶瑞久; 佐藤信太郎; 横山直樹20132013, vol.113, no.451
導電性下地上でのカーボンナノチューブの低温·稠密成長野田優; 羅ヌリ; 白井聖; 野村桂甫; 長谷川馨20132013, vol.113, no.451
気相堆積重合ポリイミドを用いたTSVライナー形成福島誉史; マリアッパンムルゲサン; 裴志哲; 李康旭; 小柳光正20132013, vol.113, no.451
先端Low-k配線技術における課題と指針井上尚也20132013, vol.113, no.451



制造业外文文献服务平台