期刊


ISSN0020-2967
刊名Transactions of the Institute of Metal Finishing
参考译名金属精饰学会汇刊
收藏年代1998～2024



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2014, vol.92, no.1 2014, vol.92, no.2 2014, vol.92, no.3 2014, vol.92, no.4 2014, vol.92, no.5 2014, vol.92, no.6

题名作者出版年年卷期
Calculation approach for current-potential behaviour during pulse electrodeposition based on double-layer characteristicsScharf, I.; Sieber, M.; Lampke, T.20142014, vol.92, no.6
Combined pulsing currents and agitation for electrodepositionColeman, S.; Roy, S.20142014, vol.92, no.6
Influence of anodic pulses and periodic current reversion on electrodepositsLeisner, P.; Zanella, C.; Belov, I.; Edstrom, C.; Wang, H.20142014, vol.92, no.6
Direct and pulse plating of metastable Zn-Ni alloysIeffa, S.; Bernasconi, R.; Nobili, L.; Cavallotti, P. L.; Magagnin, L.20142014, vol.92, no.6
Stress control in high speed nickel plating by use of step control currentKirihara, S.; Umeda, Y.; Tashiro, K.; Honma, H.; Takai, O.20142014, vol.92, no.6
Advanced Ni-W coatings obtained by the combination of pulse plating and chemometric techniquesImaz, N.; Diez, J. A.; Ostra, M.; Sarret, M.; Garcia-Lecina, E.20142014, vol.92, no.6
Effects of pulsed current on plasma electrolytic oxidationMann, R.; Hansal, W. E. G.; Hansal, S.20142014, vol.92, no.6
UntitledLarson, Clive20142014, vol.92, no.6
Calculation approach for current-potential behaviour during pulse electrodeposition based on double-layer characteristicsScharf, I.; Sieber, M.; Lampke, T.20142014, vol.92, no.6
Combined pulsing currents and agitation for electrodepositionColeman, S.; Roy, S.20142014, vol.92, no.6
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