期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告:可靠性
收藏年代2000~2024



全部

2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024

2015, vol.115, no.100 2015, vol.115, no.101 2015, vol.115, no.102 2015, vol.115, no.103 2015, vol.115, no.104 2015, vol.115, no.106
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2015, vol.115, no.88 2015, vol.115, no.9

题名作者出版年年卷期
Fabrication of highly reliable Co(W) thin film by physical vapor deposition for next generation ULSI Cu interconnectsTaewoong Kim; Kouta Tomita; Takeshi Momose; Takaaki Tsunoda; Takayuki Moriwaki; Yukihiro Shimogaki20152015, vol.115, no.417
Fabrication of Multilayer Graphene by Solid Phase Precipitation with Current StressMd. Sahab Uddin; Hiroyasu Ichikawa; Shota Sano; Kazuyoshi Ueno20152015, vol.115, no.417
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integrationKangwook LEE; Takafumi FUKUSHIMA; Tetsu TANAKA; Mitsumasa KOYANAGI20152015, vol.115, no.417
Copper Thin Film Growth using Cu(I) Amidinate Precursor in Supercritical Carbon DioxideMd RASADUJJAMAN; Mitsuhiro WATANABE; Hiroshi SUDOH; Hideaki MACHIDA; Eiichi KONDOH20152015, vol.115, no.417
BTA-H_2O_2溶液中におけるCu表面のその場エリプソメトリ川上達也; 近藤英一; 渡邉満洋; 濱田聡美; 嶋昇平; 檜山浩國20152015, vol.115, no.417
400万個のマイクロバンプ接続を有する1600画素3次元積層型イメージセンサの信頼性試験結果竹本良章; 高澤直裕; 月村光弘; 齊藤晴久; 近藤亨; 加藤秀樹; 青木潤; 小林賢司; 鈴木俊介; 五味祐一; 松田成介; 只木芳隆20152015, vol.115, no.417
低温作製された窒化物薄膜の特性武山真弓; 佐藤勝; 小林靖志; 中田義弘; 中村友二; 野矢厚20152015, vol.115, no.417
ラジカル処理を用いた低温TiN_x膜の特性評価佐藤勝; 武山真弓; 野矢厚20152015, vol.115, no.417
バンプレスインターコネクトを用いた三次元積層DRAM向けのウエハ薄化評価結果金永ソク; 児玉祥一; 水島賢子; 中村友二; 前田展秀; 藤本興治; 川合章仁; 大場隆之20152015, vol.115, no.417
2.5D/3D TSV用実装材料技術満倉一行; 牧野竜也; 畠山恵一; Kenneth June REBIBIS; Andy MILLER; Eric BEYNE20152015, vol.115, no.417
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