期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2016, vol.138, no.1 2016, vol.138, no.2 2016, vol.138, no.3 2016, vol.138, no.4

题名作者出版年年卷期
Decomposable and Template Polymers: Fundamentals and ApplicationsUzunlar, Erdal; Schwartz, Jared; Phillips, Oluwadamilola; Kohl, Paul A.20162016, vol.138, no.2
Stretchable Thin Film Materials: Fabrication, Application, and MechanicsWang, Yu; Li, Zhengwei; Xiao, Jianliang20162016, vol.138, no.2
Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and PerspectivesXie, Bin; Hu, Run; Luo, Xiaobing20162016, vol.138, no.2
Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear JointTan, Yansong; Li, Xin; Mei, Yunhui; Chen, Gang; Chen, Xu20162016, vol.138, no.2
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape StudySiow, K. S.; Lin, Y. T.20162016, vol.138, no.2
Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal CyclingHamasha, Sa'd; Borgesen, Peter20162016, vol.138, no.2
Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes PackagingShang, Bofeng; Yu, Xingjian; Zheng, Huai; Xie, Bin; Chen, Qi; Luo, Xiaobing20162016, vol.138, no.2
Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal SimulationsDogruoz, M. Baris20162016, vol.138, no.2
Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution AnalysisXiao, Yanyi; Wang, Wen; Zhang, Jianhua20162016, vol.138, no.2
Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial ChannelsSchultz, Mark; Yang, Fanghao; Colgan, Evan; Polastre, Robert; Dang, Bing; Tsang, Cornelia; Gaynes, Michael; Parida, Pritish; Knickerbocker, John; Chainer, Timothy20162016, vol.138, no.2
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