期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

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2004 2005 2006 2007 2008 2009
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2016, vol.16, no.1 2016, vol.16, no.10 2016, vol.16, no.11 2016, vol.16, no.12 2016, vol.16, no.2 2016, vol.16, no.3
2016, vol.16, no.4 2016, vol.16, no.5 2016, vol.16, no.6 2016, vol.16, no.7 2016, vol.16, no.9

题名作者出版年年卷期
IPC Initiative to Standardize Machine Communications and Meet the Challenges of Industry 4.0JASON SPERA20162016, vol.16, no.4
Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE TechnologyWENNY TSAI20162016, vol.16, no.4
Advanced Soldering Technology: Crucial for Extreme Aerospace EnvironmentsKEIICHI (KEN) TAKAHASHI20162016, vol.16, no.4
Open Manufacturing Language (OML), the New Specification for Factory Machine-to-Machine CommunicationMICHAEL FORD; DAN BAILEY20162016, vol.16, no.4
APEX Lights Up Las VegasTREVOR GALBRAITH20162016, vol.16, no.4
SMT/Hybrid/Packaging 2016 Focuses on Printed ElectronicsTrevor Galbraith20162016, vol.16, no.4
Rough First Quarter in Asia; Very Modest Global Growth AheadWALT CUSTER; JOHN CUSTER-TOPAI20162016, vol.16, no.4
Per-Olof Loof: KEMET Electronics CorporationOlof Loof20162016, vol.16, no.4



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