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期刊
ISSN
0946-7076
刊名
Microsystem technologies
参考译名
微系统技术:传感器,致动器与系统集成
收藏年代
1998~2024
关联期刊
参考译名
收藏年代
Journal of Information Storage and Processing Systems
存储与处理系统信息杂志
2000~2001
全部
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2017, vol.23, no.1
2017, vol.23, no.10
2017, vol.23, no.11
2017, vol.23, no.12
2017, vol.23, no.2
2017, vol.23, no.3
2017, vol.23, no.4
2017, vol.23, no.5
2017, vol.23, no.6
2017, vol.23, no.7
2017, vol.23, no.8
2017, vol.23, no.9
题名
作者
出版年
年卷期
Novel shock wave excitation method for dynamic characterization of microstructures
She, Dongsheng; Yang, Yiliu; Wei, Zefei; Li, Kun; Yu, Zhen; Ding, Feng
2017
2017, vol.23, no.1
Capacitance and sensitivity calculation of double touch mode capacitive pressure sensor: theoretical modelling and simulation
Jindal, Sumit Kumar; Raghuwanshi, Sanjeev Kumar
2017
2017, vol.23, no.1
Electric field and induced charges distribution model for MEMS strip-type sensing electrodes
Fang, Yigeng; Peng, Chunrong; Yang, Pengfei; Fang, Dongming; Xia, Shanhong
2017
2017, vol.23, no.1
Research on the non-ideal dynamics of a dual-mass silicon micro-gyroscope
Yang, Bo; Wang, Xingjun; Hu, Di; Wu, Lei
2017
2017, vol.23, no.1
Closed form solutions for nonlinear static response of curled cantilever micro-/nanobeams including both the fringing field and van der Waals force effect
Sun, Youhong; Yu, Yongping; Wu, Baisheng; Liu, Baochang
2017
2017, vol.23, no.1
Development of implantable catheter flow sensor into inside of bronchi for laboratory animal
Shikida, Mitsuhiro; Matsuyama, Takuya; Yamada, Takayuki; Matsushima, Miyoko; Kawabe, Tsutomu
2017
2017, vol.23, no.1
Resilient controller design availing recursive technique rooted Lyapunov function for a dynamic system
Aneesh, V.; Antony, Rahul; Nandagopal, M. S. Giri; Paramasivan, Ganesh; Selvaraju, N.
2017
2017, vol.23, no.1
Design and fabrication of microfluidic inkjet chip with high voltage ESD protection system for DNA droplets arrangement and detection
Liou, Jian-Chiun; Wu, Chia-Ching
2017
2017, vol.23, no.1
Portable signal conditioning system of a MEMS magnetic field sensor for industrial applications
Lara-Castro, M.; Herrera-May, A. L.; Juarez-Aguirre, R.; Lopez-Huerta, F.; Ceron-Alvarez, C. A.; Cortes-Mestizo, I. E.; Morales-Gonzalez, E. A.; Vazquez-Leal, H.; Dominguez-Nicolas, S. M.
2017
2017, vol.23, no.1
Fabrication of bonded SiC structure with cavity based on direct bonding process for MEMS device applications
Liang, Ting; Wang, Xinxin; Jia, Pinggang; Zhang, Wendong; Xue, Chenyang; Xiong, Jijun
2017
2017, vol.23, no.1
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