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期刊
ISSN
0960-1317
刊名
Journal of Micromechanics and Microengineering
参考译名
微型机械与微型工程学报
收藏年代
2006~2025
全部
2006
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2009
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2018
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2025
2018, vol.28, no.1
2018, vol.28, no.10
2018, vol.28, no.11
2018, vol.28, no.12
2018, vol.28, no.2
2018, vol.28, no.3
2018, vol.28, no.4
2018, vol.28, no.5
2018, vol.28, no.6
2018, vol.28, no.7
2018, vol.28, no.8
2018, vol.28, no.9
题名
作者
出版年
年卷期
Microstructure-tunable highly conductive graphene-metal composites achieved by inkjet printing and low temperature annealing
Zhao, Jie; Song, Man; Wen, Chenyu; Majee, Subimal; Yang, Dong; Wu, Biao; Zhang, Shi-Li; Zhang, Zhi-Bin
2018
2018, vol.28, no.3
Design and fabrication of a continuously tuned capacitor by microfluidic actuation
Habbachi, Nizar; Boussetta, Hatem; Boukabache, Ali; Kallala, Mohamed Adel; Pons, Patrick; Besbes, Kamel
2018
2018, vol.28, no.3
Characterization of a piezoelectric MEMS actuator surface toward motion-enabled reconfigurable RF circuits
Tellers, M. C.; Pulskamp, J. S.; Bedair, S. S.; Rudy, R. Q.; Kierzewski, I. M.; Polcawich, R. G.; Bergbreiter, S. E.
2018
2018, vol.28, no.3
Design of protein-responsive micro-sized hydrogels for self-regulating microfluidic systems
Hirayama, Mayu; Tsuruta, Kazuhiro; Kawamura, Akifumi; Ohara, Masayuki; Shoji, Kan; Kawano, Ryuji; Miyata, Takashi
2018
2018, vol.28, no.3
A two-step sealing-and-reinforcement SU8 bonding paradigm for the fabrication of shallow microchannels
Mehboudi, Aryan; Yeom, Junghoon
2018
2018, vol.28, no.3
Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations
Aono, T.; Kazama, A.; Okada, R.; Iwasaki, T.; Isono, Y.
2018
2018, vol.28, no.3
Design rules for vertical interconnections by reverse offset printing
Kusaka, Yasuyuki; Kanazawa, Shusuke; Ushijima, Hirobumi
2018
2018, vol.28, no.3
Fabrication and characterization of bending and pressure sensors for a soft prosthetic hand
Majidi, Carmel; Rocha, Rui Pedro; Lopes, Pedro Alhais; de Almeida, Anibal T.; Tavakoli, Mahmoud
2018
2018, vol.28, no.3
Electrospray performance of interacting multi-capillary emitters in a linear array
Kumar, V.; Srivastava, A.; Shanbhogue, K. M.; Ingersol, S.; Sen, A. K.
2018
2018, vol.28, no.3
A repeatable and scalable fabrication method for sharp, hollow silicon microneedles
Kim, H.; Theogarajan, L. S.; Pennathur, S.
2018
2018, vol.28, no.3
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