期刊


ISSN0913-5685
刊名電子情報通信学会技術研究報告
参考译名电子信息通信学会技术研究报告：可靠性
收藏年代2000～2024



全部

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2018 2019 2020 2021 2022 2023
2024

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题名作者出版年年卷期
Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packagingMurugesan Mariappan; Takafumi Fukushima20192019, vol.119, no.410
High-precision Dual Damascene Fabrication TechniqueY. Iizuka; Y. Kikuchi; K. Maekawa; M. Fujikawa; T. Yamaguchi; S. Nozawa; H. Kawasaki20192019, vol.119, no.410
Nanophotonics contributions to state-of-the-art CMOS Image SensorsSozo YOKOGAWA20192019, vol.119, no.410
BTA-H_2O_2溶液中Cu, Co表面の保護膜形成に関する考察近藤英一; 遠山真央; 竹内翔太; 金蓮花; 小篠涼太; 濱田聡美; 嶋昇平; 檜山浩國20192019, vol.119, no.410
［招待講演］強誘電体Hf_(0.5)Zr_(0.5)O_2膜中へ単層Si挿入により均一埋設したAlナノクラスタが強誘電体トランジスタの閾値電圧ばらつきに与える効果山口直; 前川径一; 大原隆裕; 天羽生淳; 佃栄次; 園田賢一郎; 柳田博史; 井上真雄; 山下朋弘; 松浦正純20192019, vol.119, no.410
CMP後洗浄後の銅配線表面の安定性: 銅配線上の異常成長とその要因河瀬康弘; 柴田俊明; 草野智博; 原田憲; 竹下寛20192019, vol.119, no.410
［招待講演］真空紫外光を用いた印刷·めっきによる配線技術三成剛生; Wanli Li; Qingqing Sun; Lingying Li; Xuying Liu; 金原正幸20192019, vol.119, no.410
［招待講演］異種デバイスの高密度実装用極薄接合材料茅場靖剛; 中村雄三; 鎌田潤; 河関孝志; 高村一夫20192019, vol.119, no.410
マイクロ熱電発電素子のための低熱抵抗金属／絶縁体積層薄膜の開発詹天卓; 馬帥哲; 金志成; 武澤宏樹; 目崎航平; 富田基裕; 呉彦儒; 徐一斌; 渡邉孝信20192019, vol.119, no.410



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